info@dgmarket.com +1 (202) 241 0600

Public Tender Announcement For Data Processor Chip Packaging Project Of Institute Of Computing Technology, Chinese Academy Of Sciences

General Information

Countries:
China
Notice/Contract Number:
t20251114_25702911
Original Site Publication Date:
2025-11-14 00:00:00
Create/Change Date:
2025-11-14 14:22:26
Deadline:
2025-11-29 00:00:00
Original Language:
Chinese
Procurement Method:
Other
Notice Type:
Invitation for Bids
Notice Status:
Published

CPVs

Categories

Original Text

You need to pay from a subscription to see Notice Body.
Please note that this notice is for your information only.
We try our best to have the most accurate and up-to-date information available on our web site, but we cannot guarantee that all of the information provided is error-free.
If you have any updates,corrections,or complaints related to this notice, please contact the responsible purchaser directly.
No
Status
User
Date
1
published
importer@dgmarket.com
2025-11-14 14:22:26
Please login first

dgMembership Packs

Compare the plans to see which one is right for you. Your Plans, Your Way
Join Free

Free

 

 

Join dgMarket for free and get access to the global procurement notices*

Join now
Free upon registration
Yearly

$0

1 user

  • Summaries of notices
  • Search Opportunities.
  • Daily email alerts.
  • Access to unlimited procurement notices every day
  • 1 user Access.
Be a member
Basic
Yearly

$550

1 user

  • Summaries of and International procurement notices
  • Search Opportunities.
  • Daily email alerts.
  • Access to unlimited procurement notices and 25 International Tenders every month
  • 1 user Access.
Be a member
Full
Yearly

$1,000

1 user

  • Summaries of and International procurement notices
  • Search Opportunities.
  • Daily email alerts.
  • Access to unlimited procurement notices and 500 International Tenders every month
  • 1 user Access.
Be a member